Report Highlights

According to a research survey conducted by ChemView Consulting, Temporary Bonding Adhesives Market is estimated to be worth US$ 1.53 Bn in 2023. The market is expected to grow at a CAGR of 5.60 % between 2023 and 2033 to hit US$ 2.65 Bn by 2033 end.

Key Market Trends

Increased Adoption of Water-Soluble Temporary Bonding Adhesives

As environmental concerns continue to rise, the temporary bonding adhesive market is seeing a shift towards more sustainable solutions. Water-soluble temporary bonding adhesives are gaining popularity due to their biodegradability and low VOC emissions. Manufacturers who develop and promote such eco-friendly adhesives have a competitive advantage in the market. By emphasizing the benefits of water-soluble adhesives, companies can attract environmentally conscious customers and make a positive impact on the environment.

Rising Demand for UV-Curable Temporary Bonding Adhesives

With the increasing demand for high-performance and efficient bonding solutions, UV-curable temporary bonding adhesives are becoming more popular. These adhesives provide fast and strong bonding capabilities without the need for heat or solvents. They are ideal for a wide range of applications, from electronic devices to automotive manufacturing. Manufacturers who invest in UV-curable adhesives can take advantage of this trend and differentiate themselves from competitors. By highlighting the benefits of fast curing times and superior performance, companies can attract customers who require reliable and efficient bonding solutions.

Market Drivers

Rising Demand for Consumer Electronics and Miniaturization of Electronic Devices to Boost the Temporary Bonding Adhesives Market

The temporary bonding adhesives market is driven by the increasing demand for consumer electronics, which has led to the miniaturization of electronic devices. As electronic devices become smaller and more complex, the need for temporary bonding adhesives that can hold multiple layers of components together during the manufacturing process becomes more important.

The rise of the Internet of Things (IoT) and the adoption of smart home devices are also expected to drive the demand for temporary bonding adhesives. These devices require small and complex electronic components that need to be assembled in a precise and efficient manner, which can be achieved with the use of temporary bonding adhesives.

Growing Use of Renewable Energy to Drive the Temporary Bonding Adhesives Market

The temporary bonding adhesives market is also driven by the growing use of renewable energy. The production of solar panels, wind turbines, and other renewable energy technologies requires the use of semiconductors and microchips, which are held together using temporary bonding adhesives. Government initiatives and funding are expected to drive the Asia Pacific temporary bonding adhesives market’s growth. Many countries in the region have launched several initiatives to boost their semiconductor and electronics industries, which are the primary users of temporary bonding adhesives. For instance, the Indian government launched the Electronics Manufacturing Cluster (EMC) scheme to attract investment in the electronics sector.

Segmentation Insights

After conducting a thorough analysis of the Temporary Bonding Adhesives Market, we have identified the top three trending segments in the industry. These segments are experiencing high demand, strong market growth, and widespread adoption.

Most Popular (Fastest Growth Rate)

Silicones – Semiconductor Industry

Silicones have emerged as the most popular choice in the Temporary Bonding Adhesives Market for the Semiconductor Industry. These adhesives provide excellent adhesion and have the ability to withstand high-temperature processes, making them ideal for temporary bonding in semiconductor applications. The high reliability and performance of silicones make them the preferred choice for consumers seeking efficient and effective temporary bonding solutions in the semiconductor industry.

Most Selling (Largest Market Share)

Thermoplastics – 3D Integrated Circuits

Thermoplastics are the most selling product in the Temporary Bonding Adhesives Market for 3D Integrated Circuits. These adhesives offer excellent bonding properties, good chemical resistance, and easy processing capabilities, making them ideal for temporary bonding in 3D integrated circuits. The high performance and compatibility of thermoplastics make them the go-to choice for consumers seeking reliable and effective temporary bonding solutions in 3D integrated circuits.

Trending (Gaining Traction)

Modified Epoxy – CMOS Image Sensors

Modified Epoxy adhesives are gaining significant traction in the Temporary Bonding Adhesives Market for CMOS Image Sensors. These adhesives offer excellent bonding strength, thermal stability, and chemical resistance, making them ideal for temporary bonding in CMOS image sensor manufacturing. The exceptional performance and high-quality results of modified epoxy adhesives make them the trending choice for consumers seeking reliable and effective temporary bonding solutions in CMOS image sensors.

Regional Insights

Growing Trend of Automation in Manufacturing Drives the Temporary Bonding Adhesives Market in North America

The temporary bonding adhesives market in North America is witnessing significant growth due to the increasing trend of automation in manufacturing. Automation has become a key factor in the manufacturing industry, and temporary bonding adhesives are widely used in the production of automated systems.

Asia: A Growing Market with Expanding Electronics Industries

The Asian market, including countries like China, India, and Japan, is witnessing rapid growth in the temporary bonding adhesives market. The region’s expanding electronics industries and increasing demand for high-quality temporary bonding adhesives in various applications have contributed to the rising demand for temporary bonding adhesives. The increasing focus on product development and the cost-competitive advantages of the region make Asia an attractive market for temporary bonding adhesives manufacturers and investors.

Report Includes

Market Size Data

• Global market size data, historical (2018 to 2022) and forecast (2023 to 2033), by each segment and region
• Regional level market size data, historical (2018 to 2022) and forecast (2023 to 2033), by each segment and country
• Country level market share data, historical (2018 to 2022) and forecast (2023 to 2033), by each segment
• Market attractiveness analysis based on market share index and CAGR index for each of the segments and regions
• Incremental dollar opportunity generated in the forecast period would be indicated
• Key Takeaways, Recommendations, and key investment pockets for the relevant segments would be highlighted

Market Background

• Macroeconomic factors that impact the market developments
• Market dynamics (Drivers, Restraints, Opportunities) that positively or negatively influence market growth
• Supply Side and Demand Side trends – trends witnessed from buyers and suppliers side
• Production and Consumption Gap Analysis – analysis of gap between production and consumption in any geography to fulfil unmet demand
• Trade analysis and analysis of key supply and demand hubs
• Identification of hotbed opportunities existing in the market
• Porter’s and PEST analysis to understand the business environment of the geography
• Regulatory scenario – Identification of key sector specific and trade regulations, and assessment of whether it helps or hinder market development & growth

Pricing Analysis

• Regional-level product pricing analysis to set and benchmark your current or future product offerings across each product type
• Historical and projected pricing trends of the product which helps in determining the product’s price and/or services beneficial for companies product lifecycle
• Cost teardown analysis and key factors impacting pricing

Value Chain Analysis

• Country-wise list of raw material suppliers
  • Raw material price trends and buyers’ sentiment
  • Overview of Intelligent Sourcing Technique
  • Raw material procurement requirements
  • Vendor selection criteria
• Country-wise list of product manufacturers
• Country-wise list of distributors/traders
• Country-wise list of end-users
  • End-Users/Customers consumption mapping
  • Key End-Users/Customers client list
• Country-wise list of other key channel partners
• Average profitability margins
• Regional value chain dynamics

Competition Analysis

• • Market shares and production capacities of key players
  • Tier structure analysis of market
  • Comprehensive competition dashboard representing the top 10-15 players in the market
  • Individual company profiles of top 15 to 20 manufacturers
    • Business Overview
    • Product Portfolio
    • Key Financials
    • Recent Developments
    • SWOT Analysis
    • Strategies

Research Scope/Taxonomy
Market Analysis by Material Type:

• Wax
• Silicones
• Thermoplastics
• Modified Epoxy
• Others

Market Analysis by Application:

• Semiconductor
• 3D Integrated Circuits
• CMOS Image Sensors
• Light-emitting Diodes (LED)
• Memory and Logic Chips
• Others
• Manufacturing
• Other Industrial

Country Coverage
North America: U.S., Canada
Latin America: Brazil, Mexico, Argentina, Central America, Rest of Latin America
Western Europe: Germany, Italy, France, UK, Spain, Poland, Romania, Rest of Western Europe
Eastern Europe: Russia & Belarus, Balkan Countries, Baltic Countries, Central Asia, Rest of Eastern Europe
Middle East & Africa: KSA, UAE, Turkey, Israel, Northern Africa, South Africa, Rest of Middle East & Africa
East Asia: China, Japan, South Korea
South Asia & Pacific: India, ASEAN, Australia & New Zealand, Rest of South Asia & Pacific

Key Companies Profiled

• 3M Company
• Henkel Corporation
• AI Technology, Inc
• SUSS MicroTec
• Brewer Science, Inc.
• Dow Chemical Company
• Thin Materials AG
• I. du Pont de Nemours and Company (DuPont)
• Nitto Denko
• Valtech Corporation

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